收发机
光子学
光电子学
材料科学
硅
硅光子学
计算机科学
CMOS芯片
作者
Michiyo Kubo,Shigeru Kobayashi,Koichi Takemura,Makoto Kuwata‐Gonokami,Kazuhiko Kurata
出处
期刊:
日期:2025-04-15
卷期号:: 153-154
被引量:1
标识
DOI:10.23919/icep-iaac64884.2025.11002917
摘要
We propose a novel passive alignment method for a 41°-cleaved fiber array attached to a miniaturized silicon photonic optical transceiver. The cleaved end-face has an oval-shaped dent corresponding to the refractive index profile of the multimode fiber. Since the dent is visually recognized, the center of the core can be determined by image recognition. We assembled optical modules with 41°-cleaved fiber arrays to validate the proposed alignment method and found that the assembled module showed no major optical output degradation caused by passive alignment over the wide temperature range of 0°C to 125 °C. This alignment method is thus promising for manufacturing on-board and near-packaged micro-transceivers.
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