材料科学
复合材料
微观结构
钨
铜
电阻率和电导率
复合数
多孔性
冶金
电气工程
工程类
作者
Rong Li,Wenge Chen,Kai Zhou,Yuxuan Sun,Yahui Wen,Zhe Wang,Ahmed Elmarakbi,Yongqing Fu
标识
DOI:10.1016/j.jallcom.2023.170859
摘要
Copper-tungsten (Cu-W) composites with a copper content larger than 50 vol% are expected to have a good combination of electrical conductivity and mechanical properties. However, it is difficult to synthesize these types of composites using the conventional manufacturing routes. In this paper, W skeletons with a high porosity up to 80 ± 0.8% and well-aligned microstructures were prepared by directional solidification of aqueous slurries of W followed by ice sublimation and heat treatment. Tungsten reinforced copper matrix composites (e.g., Cu-15 vol% W composites) were fabricated by infiltration of Cu into the W skeleton structures, and their microstructure, electrical conductivity and mechanical properties were studied. The synthesized Cu-15 vol% W composites exhibited alternately patterned Cu and W microstructures and showed a good combination of electrical conductivity of 78 ± 2% IACS and hardness of 136 ± 6HV. The strengthening mechanisms of these Cu-15 vol% W composites were identified as the formation of tungsten network structures which support and strengthen the copper matrix. Residual pores in the W lamellae and weak interfaces of copper-tungsten caused the initiation and propagation of cracks, and the fracture mode of Cu-15 vol% W composite was polymerization induced ductile fracture.
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