前端和后端
脑植入物
脑-机接口
CMOS芯片
计算机科学
材料科学
专用集成电路
基质(水族馆)
接口(物质)
多电极阵列
神经假体
神经形态工程学
电极
计算机硬件
光电子学
工程类
微电极
生物医学工程
人工神经网络
物理
并行计算
机器学习
脑电图
气泡
人工智能
最大气泡压力法
地质学
精神科
操作系统
海洋学
量子力学
心理学
作者
Markus Sporer,Ioana-Georgiana Vasilaș,Ahmed Adžemović,Nicolas Graber,Stefan Reich,Calogero Gueli,Max Eickenscheidt,Ilka Diester,Thomas Stieglitz,Maurits Ortmanns
标识
DOI:10.1109/tbcas.2024.3354785
摘要
This article presents the system architecture for an implant concept called NeuroBus. Tiny distributed direct digitizing neural recorder ASICs on an ultra-flexible polyimide substrate are connected in a bus-like structure, allowing short connections between electrode and recording front-end with low wiring effort and high customizability. The small size (344 μm × 294 μm) of the ASICs and the ultraflexible substrate allow a low bending stiffness, enabling the implant to adapt to the curvature of the brain and achieving high structural biocompatibility. We introduce the architecture, the integrated building blocks, and the post-CMOS processes required to realize a NeuroBus, and we characterize the prototyped direct digitizing neural recorder front-end as well as polyimide-based ECoG brain interface. A rodent animal model is further used to validate the joint capability of the recording front-end and thin-film electrode array.
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