飞秒
材料科学
激光器
激光加工
脆性
冲击波
激光打孔
休克(循环)
碳化硅
微加工
光学
钻探
光电子学
脉搏(音乐)
复合材料
制作
冶金
航空航天工程
激光束
工程类
物理
医学
替代医学
病理
探测器
内科学
作者
Junya Hattori,Yusuke Ito,Naohiko Sugita
出处
期刊:CIRP Annals
[Elsevier]
日期:2023-01-01
卷期号:72 (1): 185-188
被引量:2
标识
DOI:10.1016/j.cirp.2023.03.012
摘要
Femtosecond lasers have attracted attention as tools for the microfabrication of various materials, such as semiconductors, insulators, and metals. When hard and brittle materials are processed by femtosecond lasers, shock waves that propagate during processing generate cracks around the processed area, making precision processing difficult. In this study, we propose and demonstrate multi-step drilling where, after drilling a pilot hole with a small pulse energy, the hole is expanded by increasing the pulse energy in a stepwise manner without generating strong shock waves. The proposed method suppresses cracks in silicon carbide by approximately 70% and could be an important option for femtosecond laser microdrilling.
科研通智能强力驱动
Strongly Powered by AbleSci AI