热导率
热的
材料科学
电子设备和系统的热管理
热传导
机械工程
工程物理
软件部署
热能
保温
热桥
多孔介质
纳米技术
传热
多孔性
高效能源利用
热辐射
作者
Feng Du,Jiamin Zhou,Quan Li
摘要
ABSTRACT Low thermal conductivity (K) materials are central to energy saving, thermal management, and extreme‐environment protection. Recent advances in aerogels, polymers, porous ceramics, composites, and architected materials have greatly expanded the design space for high‐performance thermal insulators. This review summarizes the latest progress toward the ultimate thermal insulator from the perspective of heat transport regulation, with emphasis on suppressing solid conduction, gas conduction, and thermal radiation through multiscale structural engineering. Key material systems and design strategies are highlighted, together with the structure–property relationships governing ultralow thermal conductivity. Current challenges in mechanical stability, environmental durability, scalability, and practical deployment are also discussed. This review provides a concise framework for understanding the mechanism, recent developments, and guiding the design of next‐generation thermal insulating materials.
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