材料科学
跨导
光电子学
兴奋剂
阻挡层
高电子迁移率晶体管
击穿电压
阈值电压
宽禁带半导体
氮化镓
图层(电子)
晶体管
电压
电气工程
纳米技术
工程类
作者
Ling Yang,Bin Hou,Fuchun Jia,Meng Zhang,Mei Wu,Xuerui Niu,Hao Lu,Chunzhou Shi,Minhan Mi,Qing Zhu,Yang Lu,Xiaohua Ma,Yue Hao
标识
DOI:10.1109/ted.2022.3179675
摘要
In this article, the impact of the graded AlGaN back barrier and Fe\C co-doping buffer structure on the AlGaN $/$ GaN high electron mobility transistors (HEMTs) is proposed and systematically investigated. Due to effective suppression of Fe tail in unintentionally doped GaN (uid-GaN) layer by the insertion of the thick graded AlGaN back barrier layer, a large maximum drain current density and a transconductance peak are achieved. Meanwhile, the breakdown voltage is significantly improved by the use of Fe\C co-doping GaN buffer design. More importantly, it is revealed that the graded-AlGaN design can reduce the range and intensity of the electrical potential distribution in uid-GaN layer and then effectively suppress the acceptor-induced trapping\detrapping effect under high drain voltage. The RF small-signal performance of Fe-doped GaN (GaN:Fe)\C co-doping buffer HEMT exhibits significant improvement. In addition, load-pull measurement at 8 GHz revealed that a saturation power increases from 38.04 to 41.07 dB, a power gain increases from 9.06 to 10.58 dB, and an associate power-added-efficiency (PAE) increased from 40.27% to 50.18%. Our proposed GaN-based epitaxial structure can not only suppress the gate lag by reduce AlGaN surface electric field, but it can also suppress the drain lag by reduce the amplitude and range of potential distribution. It indicates that our proposed device has great potential for future high-voltage RF power amplifier application.
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