德拉姆
系统集成
计算机科学
薄脆饼
晶圆规模集成
云计算
数码产品
嵌入式系统
可靠性(半导体)
模具准备
系统工程
工程类
可靠性工程
制造工程
操作系统
电气工程
计算机硬件
超大规模集成
功率(物理)
晶片切割
物理
量子力学
出处
期刊:Technical digest
[Institute of Electrical and Electronics Engineers]
日期:2014-12-01
卷期号:: 27.1.1-27.1.4
被引量:34
标识
DOI:10.1109/iedm.2014.7047117
摘要
A family of novel wafer-level-system-integration technologies (WLSI) was proposed. This paper reviews WLSI feasibility work first. Further results on the reliability, the compatibility of the integration with both more advanced node Logic and DRAM devices, and the higher-level system integration of the WLSI technologies are then presented. Foundry has established a comprehensive system integration technology portfolio in wafer form to fulfill the needs from mobile to cloud computing for the future growth of the Si-based nano-electronics industry.
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