等离子体
成核
薄脆饼
离子
粒子(生态学)
原子物理学
硅
分析化学(期刊)
激光器
化学
蚀刻(微加工)
材料科学
纳米技术
光学
色谱法
光电子学
物理
图层(电子)
有机化学
海洋学
量子力学
地质学
作者
Gary S. Selwyn,Jay Prakash Singh,R. S. Bennett
出处
期刊:Journal of vacuum science & technology
[American Institute of Physics]
日期:1989-07-01
卷期号:7 (4): 2758-2765
被引量:487
摘要
Laser light scattering measurements show that certain silicon etching plasmas produce a significant amount of in situ, particulate contamination. The particles are suspended at the sheath boundaries. Simultaneous measurement of plasma negative ions by the use of two-photon laser-induced fluorescence technique suggests that the particles are negatively charged and so are electrostatically trapped at the sheath boundaries. The parametric conditions for particle formation and growth in the plasma are identified. A mechanism for nucleation and growth is suggested involving formation of plasma negative ions from etch products, ion clustering with plasma species, and cluster growth into particles with electrostatic suspension and trapping. The particles drop onto the wafer when the rf is turned off. Implications for dry process technology are discussed.
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