Development of a silver nanoparticle ink for fine line patterning using gravure offset printing

Abstract A newly developed silver nanoparticle ink for gravure offset printing has been prepared through the thermal decomposition reaction of silver oxalate. The resistivity of silver thin films made of the ink was estimated to be 3.1 µΩ cm by sintering at 250 °C, which is comparable to that of bulk silver. In addition, we achieved the patterning of fine lines with a width of 20 µm using the combination of the ink and gravure offset printing. The prepared ink could be used to fabricate various printed electronic circuits in the near future.