In an environmental and economic point of view, recycling of silicon wafer sludge is important. The aim of this work is to investigate the recycling method of silicon wafer sludge. Therefore, drying rate of silicon wafer sludge has been studied for separation of liquid and solid from sludge. Silicon and silicon carbide powder obtained from silicon wafer sludge were analyzed by SEM, XFR, XRD and particle size analyzer. The recovered oil was also characterized using GC-MS. From this work, it can be seen that the falling drying rate of silicon wafer sludge is linear equation. Various metal components have been found in recovered solid powder caused by wire sawing processing.