The effect of bismaleimide resin on curing kinetics of epoxy-amine thermosets

An analysis of the cure kinetics of several formulations composed of diglycidyl ether of bisphenol-A (DGEBPA) and aromatic diamines, methylenedianiline (MDA) and diaminodiphenyl sulfone (DDS), in the absence and presence of 4,4′-bismaleimidodiphenylmethane (BM) was performed. The dynamic differential scanning calorimetry (DSC) thermograms were analyzed with the help of ASTM kinetic software to determine the kinetic parameters of the curing reactions, including the activation energy, preexponential factor, rate constant, and 60 min ½ life temperature. The effects of substitution of one curing agent for another, their concentration, and the absence and presence of BM resin and its concentration on curing behavior, ethalpy, and kinetic parameters are discussed. © 1996 John Wiley & Sons, Inc.