Advancements in large format small pitch SLS infrared focal plane arrays at L3Harris

System requirements for IR imagery continues to push the limits to smaller pitch and larger formats. This enables better resolution at distance and more situational awareness. L3Harris continues to reduce pitch and increase the array size for Type II Strained Layer Superlattice (T2SLS) FPAs. Access to this detector material combined with the L3Harris front-side illuminated FPA structure lend to mechanically robust FPAs with array size only limited by detector wafer size. The current epitaxially grown material is highly uniform across the entirety of the 125 mm wafer. L3Harris will present results from improvements demonstrated on the 6144 x 4096 focal plane with an 8 micron pitch. These improvements include higher operability, yield and lower noise.