技术
补偿(心理学)
炸薯条
温度测量
大气温度范围
材料科学
航程(航空)
工作温度
光电子学
计算机科学
电气工程
物理
工程类
电信
天文
气象学
复合材料
电离层
量子力学
心理学
精神分析
作者
Shunlong He,Lintong Zhao,Jun Liu,Jialong Li,Longcheng Que,Yun Zhou,Jian Lv
标识
DOI:10.1109/jsen.2025.3565016
摘要
This paper presents a novel readout circuit architecture for uncooled infrared focal plane arrays (IRFPAs) that incorporates on-chip real-time compensation for ultra-low DC voltage drift across a wide operating temperature range, without substrate temperature stabilization. A temperature drift model is developed to characterize the drift behavior caused by substrate temperature variations, forming the basis for a real-time compensation method. The proposed approach leverages a Wheatstone bridge-based readout architecture, incorporating a temperature-dependent non-uniformity correction module to enable adaptive temperature drift correction. The proposed circuit is implemented using 180 nm CMOS technology, enabling the IRFPA to achieve a voltage drift of less than 2500 LSB over a wide temperature range of 120 . This corresponds to a 77.3% reduction compared to traditional circuits. Furthermore, the IRFPA demonstrates robust shutter-less operation, achieving a peak signal-to-noise ratio (PSNR) of 26.93 dB during image stabilization. In addition, the design achieves a Noise Equivalent Temperature Difference (NETD) of less than 50 mK over the entire temperature range. This approach provides a new framework for on-chip temperature drift compensation, eliminating reliance on thermoelectric cooling (TEC) and mechanical shutters. It is particularly suited for compact, low-cost, low-power, and lightweight thermal imaging applications.
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