Hierarchical ordered perforated surface for highly efficient liquid film boiling

Thermal management is becoming the bottleneck for high-power electronic devices and energy systems. Liquid film boiling, coupling dynamic bubbles of nucleate boiling with thin film evaporation in capillary wicks, shows great promise in simultaneously improving the two key performance metrics, critical heat flux (CHF) and heat transfer coefficient (HTC), of phase-change heat transfer processes. However, micro-/nano-structured capillary wicking surfaces need to be delicately designed for both efficient liquid delivery and the rapid escape of nucleation bubbles. Here, we demonstrate a hierarchical ordered perforated (HOP) surface that enables highly efficient liquid film boiling. By leveraging low-resistance liquid wicking, rapid bubble nucleation, and directional bubble escape, a high HTC of 978.8 kW/m 2 K and a high CHF of 693.1 W/cm 2 are achieved on the HOP mesh surface over a heating area of 5 × 5 mm 2 . Furthermore, the HOP strategy can be applied to various micro-/nano-structured surfaces, enabling new generation of high-flux thermal management technologies.