Selective metallization of piezoelectric ceramics by laser-induced surface modification combined with electroless copper plating

Conventionally, the surface of piezoelectric ceramics has been selectively metallized by screen-printing of Ag pastes. However, the use of expensive Ag materials and high-temperature annealing increases the manufacturing costs and complicates the process. In this study, simple and economical method for the selective metallization of piezoelectric ceramics has been developed. Using this method, high-adhesion copper patterns were successfully formed on piezoelectric ceramics by combining laser-induced surface modification and electroless copper plating (ECP). Although a copper layer was uniformly deposited onto the piezoelectric ceramic surface at various laser parameters, the scanning speed of 200 mm/s ensured sufficiently high adhesion strength and minimum laser damage of the piezoelectric surfaces. The d 33 and k p values of the piezoelectric ceramics with the attached ECP-processed copper and screen-printed silver electrodes were very close. These results demonstrate the possibility of fabricating low-cost copper electrodes on piezoelectric ceramics without high-temperature heat treatment or surface activation with expensive catalysts.