Two processes including direct electroless nickel plating and electroless nickel plating after a prior copper electroplating on AiSiMg alloy were studied. The surface morphologies of the deposits obtained by the two processes were compared by scanning electron microscopy, the corrosion resistance by salt spray test and the adhesion strength by file method. The results showed that the nickel deposits of the two samples have good corrosion resistance and good adhesion strength, and can provide a good protection for AlSiMg alloys. Comparing with the deposit obtained by direct electroless nickel plating, the deposit obtained by electroless nickel plating after a prior copper electroplating has more compact structure, stronger adhesion and superior corrosion resistance.