硅
热电效应
多晶硅
材料科学
工程物理
热电材料
热导率
纳米技术
光电子学
计算机科学
工程类
复合材料
物理
图层(电子)
热力学
薄膜晶体管
作者
Dario Narducci,Federico Giulio
出处
期刊:Materials
[Multidisciplinary Digital Publishing Institute]
日期:2022-02-06
卷期号:15 (3): 1214-1214
被引量:33
摘要
Silicon is the most widely used functional material, as it is geo-abundant and atoxic. Unfortunately, its efficiency as a thermoelectric material is very poor. In this paper, we present and discuss advances of research on silicon and related materials for thermoelectric applications, mostly focusing on the comparison between the two strategies deployed to increase its performance, namely either reducing its thermal conductivity or, in polycrystalline materials, increasing its power factor. Special attention will be paid to recent results concerning silicon thin films. The enhancement of Si performances has motivated efforts to develop integrated heat microharvesters operating around room temperature, which will be reviewed also in view of their applications to power wireless sensors for the Internet of Things.
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