Characteristics of interface between solid electrolyte and electrode in all-solid-state batteries prepared by spark plasma sintering

放电等离子烧结 材料科学 烧结 电解质 微观结构 电极 化学工程 电化学 图层(电子) 接口(物质) 锂(药物) 固态 复合材料 接触角 化学 物理化学 医学 坐滴法 工程类 内分泌学
作者
Huan Tong,Jian Liu,Yi Qiao,Xiping Song
出处
期刊:Journal of Power Sources [Elsevier]
卷期号:521: 230964-230964 被引量:18
标识
DOI:10.1016/j.jpowsour.2021.230964
摘要

Interface issues impede the development of all-solid-state lithium batteries (ASSLiBs). To resolve these issues, it is crucial to understand characteristics of electrode-electrolyte interface. Herein, all-solid-state symmetrical batteries and full batteries were prepared by spark plasma sintering (SPS) at 500 °C and 650 °C, using Li 1.5 Al 0.5 Ge 1.5 (PO 4 ) 3 (LAGP) and LiFePO 4 (LFP) as solid electrolyte and electrode. The microstructures and electrochemical performances of the LFP/LAGP interface and LAGP/LFP interface (different sintering current directions) were investigated. The results showed that no interface layer was formed at the LFP/LAGP interface and LAGP/LFP interface at 500 °C; however, various interface layers were formed at 650 °C. At the 650-LFP/LAGP interface, an Al-poor layer and a Fe-rich Li-poor layer composed of Fe 2 P 2 O 7 were found, while at the 650-LAGP/LFP interface, an Al-rich Li-poor layer composed of AlPO 4 was found. The interfaces sintered at 500 °C had small impedance and were able to electrochemically cycle, while those sintered at 650 °C showed large impedance and were not able to electrochemically cycle. Furthermore, the 500-LAGP/LFP interface showed better cycle stability than the 500-LFP/LAGP interface. Thus, it is concluded that the sintering temperature and sintering current direction play important roles in the ASSLiBs preparation. The formation mechanism of the interface microstructures under the SPS was also discussed. • Preparation of all-solid-state batteries by spark plasma sintering (SPS). • Different interface layers and different interface contact states. • Interface microstructures affected by sintering temperature and sintering current. • The formation mechanism of the interface microstructures is presented.

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