材料科学
光学
共焦
显微镜
薄脆饼
针孔(光学)
光电子学
激光扫描
红外线的
倒装芯片
硅
光电二极管
探测器
炸薯条
激光器
不透明度
计算机科学
纳米技术
物理
电信
胶粘剂
图层(电子)
作者
H.X. Li,J. K. Liu,Yakui Dong,Cheng Fei,Yongfu Li,Shuolin Yang,Shuzhen Fan,Yunxia Liu,Xian Zhao
标识
DOI:10.1088/1361-6501/ada81e
摘要
Abstract Today, more and more silicon-based chips apply new flip-chip packages to accommodate the high density and power consumption requirements of electronic products. In this case, defect detection in the flip-chip package is essential. However, silicon-based materials are opaque to visible wavelengths, making it difficult to identify defects within the chip or wafer. By utilizing the property that near-infrared (NIR) light can pass through silicon, NIR confocal imaging is a promising non-destructive method to detect defects inside silicon chips. In this study, we report an integrated near-infrared confocal scanning microscope system consisting of a near-infrared microscope and a near-infrared confocal scanning system, which uses an InGaAs focal plane array as a detector instead of the conventional combination of a small pinhole and a photo-multiplier tube or an avalanche photodiode. The proposed confocal scanner can detect devices of different sizes in the field of view, obtain high-contrast and three-dimensional images of the internal structure, and can be effectively employed as an in-line inspection system for detecting surface and internal defects during chip manufacturing.
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