钨
渗透(战争)
材料科学
聚能装药
扫描电子显微镜
复合材料
穿透深度
双层(生物学)
渗透试验
化学气相沉积
铜
图层(电子)
光学
冶金
纳米技术
化学
有机化学
沥青
爆炸物
工程类
物理
运筹学
作者
Bihui Hong,Wenbin Li,Yiming Li,Zhi‐wei Guo,Binyou Yan
标识
DOI:10.1016/j.dt.2023.08.016
摘要
This paper proposes a type of double-layer charge liner fabricated using chemical vapor deposition (CVD) that has tungsten as its inner liner. The feasibility of this design was evaluated through penetration tests. Double-layer charge liners were fabricated by using CVD to deposit tungsten layers on the inner surfaces of pure T2 copper liners. The microstructures of the tungsten layers were analyzed using a scanning electron microscope (SEM). The feasibility analysis was carried out by pulsed X-rays, slug-retrieval test and static penetration tests. The shaped charge jet forming and penetration law of inner tungsten-coated double-layer liner were studied by numerical simulation method. The results showed that the double-layer liners could form well-shaped jets. The errors between the X-ray test results and the numerical results were within 11.07%. A slug-retrieval test was found that the retrieved slug was similar to a numerically simulated slug. Compared with the traditional pure copper shaped charge jet, the penetration depth of the double-layer shaped charge liner increased by 11.4% and >10.8% respectively. In summary, the test results are good, and the numerical simulation is in good agreement with the test, which verified the feasibility of using the CVD method to fabricate double-layer charge liners with a high-density and high-strength refractory metal as the inner liner.
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