Temperature-Insensitive Cryogenic Packaging for Thin-Film Lithium Niobate Photonic Chips

As photonic integrated circuits (PICs) gain prominence in quantum communication and quantum computation, the development of efficient and stable cryogenic packaging technologies becomes paramount. This paper presents a robust and scalable cryogenic packaging method for thin-film lithium niobate (TFLN) photonic chips. The packaged fiber-to-chip interface shows a coupling efficiency of 15.7% ± 0.3%, with minimal variation of ±0.5% as the temperature cools down from 295 K to 1.5 K. Furthermore, the packaged chip exhibits outstanding stability over multiple thermal cycling, highlighting its potential for practical applications in cryogenic environments.