84‐4: Transfer of Flip‐Chip Structure micro‐LED from Sapphire to Thin Film

Micro‐LED has become a hotspot in the field of displays due to its advantages such as high brightness and self‐emission, and is regarded as the next‐generation display technology. Mass transfer of micro‐LED refers to the process of transferring a large number of chips from grown substrate to another carrier, which is one of the important methods to achieve full‐color display of micro‐LED, and how to achieve high yield and high speed in mass transfer has always been a focus of attention. In this paper, mass transfer process of micro‐LEDs is studied, wherein laser lift‐off technology is employed to separate the LEDs from the sapphire substrate. Taking advantage of adhesive differences in the film, the micro‐LED array is flipped twice to complete the mass transfer process.