Design and Fabrication of High Density 3D IPDs (Integrated Passive Devices) on Glass Substrate

A number of test structures for capacitors and inductors were designed and manufactured on glass substrate. The fabrication process of IPDs forming with TGVs, Si3N4layers and multilevel metal layers on glass wafer is presented in this paper. Three-dimensional full-wave electromagnetic field simulation tools were used to analyze the electrical properties of the capacitors, inductors on glass substrate. In addition, the comparison of electrical properties of thin-film IPDs on silicon and on glass substrate is given.