A Study on Particle Deposition of an Evaporating Colloidal Droplet
作者
Sang-Kwon Wee,Jung‐Yong Lee
出处
期刊:Transactions of The Korean Society of Mechanical Engineers B [Korean Society of Mechanical Engineers] 日期:2006-07-01卷期号:30 (7): 663-670
标识
DOI:10.3795/ksme-b.2006.30.7.663
摘要
The presented study aims to investigate the colloidal droplet deposition caused by evaporation of the liquid. In the numerical analysis, the evaporation is carried out by using different evaporation function intended to obtain different shape of solute deposition. In the experiment, the colloidal droplets of different solvents are placed on a glass plate and the surface profiles are measured after drying the solvents of the droplets to investigate the effect of the solvent evaporation on the final deposition profile. Comparing the surface profiles obtained under different conditions, the optimum drying conditions of colloidal droplets are determined to obtain uniform surface profiles. The numerical results showed that ring-shaped deposition of solute was formed at the edge of the droplet due to the coffee stain effect and the height of the ring was reduced at the lower evaporation rate. The experiments showed that the boiling point of a solvent was critical to the surface uniformity of the deposition profile and the mixture of solvents with different boiling points influenced the uniformity as well.