Electromechanical responses of Cu strips

作者
Guangfeng Zhao,Ming Liu,Zhinan An,Yang Ren,Peter K. Liaw,Fuqian Yang
出处
期刊:Journal of Applied Physics [American Institute of Physics]
卷期号:113 (18) 被引量:9
标识
DOI:10.1063/1.4804938
摘要

Electrical-thermal-mechanical behavior of materials plays an important role in controlling the structural integrity of electromechanical structures of small volumes. The electromechanical response of Cu strips was studied by passing an electric current through the strips with electric current densities in the range of 12.34 to 29.60 kA/cm2. The passage of the electric current of high current densities introduced electrical-thermal-mechanical interactions, which caused grain growth and grain rotation in both the melted region and heat-affected zone. The electrothermal interactions led to the elastoplastic buckling of the Cu strips with the maximum deflection of the Cu strips increasing with the increase of the electric current density. The total strain is a quadratic function of the electric current density. There was a quasi-steady state in which the electric resistance of the Cu strips linearly increased with time before the occurrence of electric fusing. A power-law relation was used to describe the dependence of the time-to-failure (electric fusing) on the electric current density. For the region of relatively low current densities, the current exponent ranged from 17.9 to 44.6, and for the region of high current densities, the current exponent ranged from 2.5 to 5.2. The current exponent for relatively low current densities decreased with increasing the length of Cu strips, showing size-dependence. Finite element analyses were performed to analyze the current-induced deflection of a Cu strip. The simulation results showed that the maximum deflection for the electric current density larger than or equal to 5 kA/cm2 is a linear function of the current density in agreement with the experimental observation.

科研通智能强力驱动
Strongly Powered by AbleSci AI
科研通是完全免费的文献互助平台,具备全网最快的应助速度,最高的求助完成率。 对每一个文献求助,科研通都将尽心尽力,给求助人一个满意的交代。
实时播报
隐形曼青应助KK采纳,获得10
刚刚
wangjia完成签到 ,获得积分10
1秒前
桐桐应助zl50268采纳,获得10
1秒前
呃呃呃发布了新的文献求助10
1秒前
哈哈完成签到 ,获得积分10
1秒前
Pu Chunyi完成签到,获得积分10
2秒前
踏实书白完成签到,获得积分10
2秒前
liu驳回了CodeCraft应助
3秒前
合蒲发布了新的文献求助10
5秒前
5秒前
5秒前
6秒前
你的完成签到 ,获得积分10
6秒前
6秒前
sunshine完成签到,获得积分10
7秒前
GMG完成签到,获得积分10
7秒前
蓝天发布了新的文献求助10
7秒前
8秒前
8秒前
Wlin发布了新的文献求助10
9秒前
阔达世开发布了新的文献求助10
9秒前
10秒前
123完成签到,获得积分10
10秒前
11秒前
GMG发布了新的文献求助10
12秒前
爱吃汉堡包的金鲤鱼完成签到,获得积分10
12秒前
科目三应助宋嘉新采纳,获得10
13秒前
冯大哥发布了新的文献求助10
13秒前
领导范儿应助合蒲采纳,获得10
13秒前
脑洞疼应助小铁匠采纳,获得10
14秒前
Charlie完成签到 ,获得积分10
14秒前
14秒前
上善若水关注了科研通微信公众号
15秒前
15秒前
16秒前
幽默枫完成签到,获得积分10
17秒前
张述杰完成签到,获得积分10
18秒前
zl50268发布了新的文献求助10
18秒前
18秒前
aaaa应助高兴的青易采纳,获得10
19秒前
高分求助中
(应助此贴封号)【重要!!请各用户(尤其是新用户)详细阅读】【科研通的精品贴汇总】 10000
Nondestructive Testing Handbook: Vol. 4, Thermal and Infrared Testing (IR), 4th ed 800
作者名:Kristopher P. Plain,悉尼大学的,目前只能查到其四篇论文,想找到其博士论文 590
Évora na Idade Média 555
Soil mites of the family Rhagidiidae (Actinedida: Eupodoidea). Morphology, Systematics, Ecology 520
Matrix Methods in Data Mining and Pattern Recognition Second Edition 510
Radical Reactions 500
热门求助领域 (近24小时)
化学 材料科学 医学 生物 纳米技术 工程类 有机化学 化学工程 生物化学 计算机科学 内科学 物理 复合材料 催化作用 细胞生物学 无机化学 光电子学 物理化学 电极 基因
热门帖子
关注 科研通微信公众号,转发送积分 7364877
求助须知:如何正确求助?哪些是违规求助? 8973692
关于积分的说明 19075796
捐赠科研通 7009598
什么是DOI,文献DOI怎么找? 3223894
关于科研通互助平台的介绍 2387657
邀请新用户注册赠送积分活动 2204726