热扩散率
热导率
热传导
材料科学
大气温度范围
硅
德拜模型
物理
凝聚态物理
热力学
冶金
作者
H. R. Shanks,Paul D. Maycock,P. H. Sidles,G. C. Danielson
出处
期刊:Physical Review
[American Institute of Physics]
日期:1963-06-01
卷期号:130 (5): 1743-1748
被引量:497
标识
DOI:10.1103/physrev.130.1743
摘要
The thermal diffusivity of pure silicon has been measured from 300 to 1400\ifmmode^\circ\else\textdegree\fi{}K. The specific heat of the same material over the same temperature range has been measured by Dennison. The thermal conductivity was obtained from the product of the thermal diffusivity, specific heat, and density. At 1400\ifmmode^\circ\else\textdegree\fi{}K about two-thirds of the thermal conductivity was caused by lattice vibrations and one-third by bipolar diffusion. Wiedemann-Franz type diffusion accounted for less than one percent of the total thermal conductivity at 1400\ifmmode^\circ\else\textdegree\fi{}K. Thermal transport by direct transmission of radiation appeared to be negligible up to 1400\ifmmode^\circ\else\textdegree\fi{}K. The Gr\"uneisen constant for silicon from these high-temperature thermal conductivity measurements was 1.96, if the Debye temperature is taken as 636\ifmmode^\circ\else\textdegree\fi{}K.
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