Thermal analysis and thermal optimization of through silicon via in 3D IC

The study on thermal problem of through silicon via has become an important part of the three dimensional integrated circuit. This paper proposes some thermal aware optimization measures of TSV to optimize thermal performance of 3D IC. Thermal performance simulations on different TSV distribution, different TSV structure parameter and different TSV cluster are done respectively. Through the simulation and analysis, qualitative, quantitative results and thermal optimization measures are presented. According to the result, optimization could be done in EDA software.