THE MICROSTRUCTURE OF THE TUNGSTEN / COPPER COMPOSITES PREPARED BY INFILTRATION

The tungsten-copper metal matrix composites for electronic packaging/heat sink application were prepared by infiltration under reductive atmosphere. The microstructures of W-Cu composites prepared under various process conditions were compared, and the effects of processing conditions, including pretreatment of tungsten powders, addition of inducing copper powders, pressure, particle size of the tungsten powder and inducing copper powder were discussed. The experiment results showed that under the conditions which tungsten powder with particle size of 5～9μm, inducing copper powder with grain size of mesh -500, the W-Cu composites with the properties of high relative density, high uniformly microstructure, can be prepared by tungsten skeleton pre-sintering and infiltration process.