Ultralow-linewidth ring laser using hybrid integration and generic foundry platforms

Two photonic integrated circuits (PICs) are coupled to form a hybridly integrated semiconductor ring laser in the telecom C band with an intrinsic linewidth of (158±21) Hz. This is, to the best of our knowledge, the first time an InP active–passive platform is used in conjunction with an integrated low-loss resonator to obtain a narrow-linewidth laser implemented using generic foundry platforms. The presented results pave the way for a hybrid integrated platform for microwave photonics (MWP), as the demonstrated device includes multiple active–passive components, and its narrow optical linewidth can potentially be translated to a narrow-linewidth microwave signal. Furthermore, as the laser is based on hybrid integration of two PICs from generic foundry platforms, there is a path to reproducible and low-cost devices.