大型强子对撞机
像素
地图集(解剖学)
辐射
探测器
物理
平面的
辐射硬化
升级
光学
辐照
炸薯条
光度
硅
光电子学
核物理学
计算机科学
计算机图形学(图像)
电信
天体物理学
古生物学
银河系
生物
操作系统
作者
Andreas Lokken Heggelund,S. K. Huiberts,O. Dorholt,A. L. Read,O. Røhne,H. Sandaker,M. Lauritzen,B. Stugu,Angela Kok,O. Koybasi,Marco Povoli,M. Bomben,J. C. Lange,A. Rummler
标识
DOI:10.1088/1748-0221/17/08/p08003
摘要
Abstract The High Luminosity LHC (HL-LHC) upgrade requires the planned Inner Tracker (ITk) of the ATLAS detector to tolerate extremely high radiation doses. Specifically, the innermost parts of the pixel system will have to withstand radiation fluences above 1 × 10 16 n eq cm -2 . Novel 3D silicon pixel sensors offer a superior radiation tolerance compared to conventional planar pixel sensors, and are thus excellent candidates for the innermost parts of the ITk. This paper presents studies of 3D pixel sensors with pixel size 50 × 50 μm 2 mounted on the RD53A prototype readout chip. Following a description of the design and fabrication steps, Test Beam results are presented for unirradiated as well as heavily irradiated sensors. For particles passing at perpendicular incidence, it is shown that average efficiencies above 96% are reached for sensors exposed to fluences of 1 × 10 16 n eq cm -2 when biased to 80 V.
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