Fabrication of copper/stainless steel bimetallic couple, by diffusion bonding using silver and nickel foils as interlayers

The Copper/Silver couple was fabricated via diffusion bonding process with the aid of nickel and silver foils as interlayers. The results indicated the width of reaction layer of interfaces was increased with the temperature enhancement. Meanwhile, the utilization of proper interlayer in addition to suitable assembly, for example in the stainless steel-Ni-Ag-Cu specimen bonded at 750 °C, led to qualified bonding even at lower temperature with the maximum shear strength (158 MPa) through all diffusion bonded joints. Additionally, the maximum and minimum micro-hardness were obtained for stainless steel/interlayer interface and Ag interlayer in each joint, respectively.