Multicore Fiber Coupled Backside-Emitting VCSEL/PD Arrays for High-Bandwidth Optical Interconnects in Data Center

We present a 19-core-MCF-coupled co-packaged optical chiplet integrating backside-emitting VCSEL and backside-illuminated PD arrays flip-bonded to driver–TIA EICs. Fundamental optical performance and thermal-path feasibility are demonstrated, with envisioned scalability toward multi-chiplet GPU optical interconnects.