Interfacial engineering of nano-copper: mechanisms, strategies, and innovations for oxidation resistance

, ligand complexes) achieve molecular-level control over surface passivation, while complexation methods utilize ligands for eco-friendly stabilization. Despite progress, challenges persist in achieving uniform shell layers, scalable fabrication, and long-term durability. Future research directions emphasize the development of low-cost, green synthesis techniques, atomic-scale interface engineering, and multifunctional nano-copper. Innovations such as dynamic coordination systems, self-healing coatings, and crystallographic orientation-specific modifications hold promise for expanding nano-copper's applicability in flexible electronics, catalysis, and biomedical fields. This review underscores the critical need for interdisciplinary approaches to translate laboratory-scale breakthroughs into industrial solutions, ultimately unlocking the full potential of nano-copper in next-generation technologies.