Brett A. Bednarcyk,Trenton M. Ricks,Evan J. Pineda,Pappu L. N. Murthy,Subodh K. Mital,Zhong Hu,Peter A. Gustafson
出处
期刊:AIAA Journal [American Institute of Aeronautics and Astronautics] 日期:2022-08-29卷期号:60 (12): 6506-6519被引量:9
标识
DOI:10.2514/1.j061920
摘要
Multiscale micromechanics predictions have been made for effective thermal conductivities and local thermal fields for a novel three-dimensional woven composite thermal protection system material. The multiscale recursive micromechanics approach, which enables micromechanics models to call other micromechanics models (or themselves recursively) to consider finer and finer length scales, has been employed. The multiscale model uses a recently developed version of the high-fidelity generalized method of cells micromechanics theory at each of three length scales. The results focus on the impact of the microstructural geometry representation at each length scale on the material’s effective thermal conductivity, along with the local thermal flux and temperature fields induced in the microstructures.