Cost-Performance Silver- Aluminum Composite Sinter Paste with Improved Joint Reliability in SiC Power Device Applications

This study is to create a new die-attach bonding materials that are capable of meeting the rigorous demands of next-generation SiC power semiconductors. A composite sintering paste composed of silver-aluminum (Ag-Al) particles was proposed for bonding SiC to the DBC substrate, leveraging the low elastic modulus and high plastic deformability of Al particles. The joint structure was evaluated during a high temperature aging test at 300°C and a power cycling test with the junction temperature of 200°C. Compared to the silver sintered structure, the Ag-Al sintered joint exhibits superior structural stability during high-temperature aging and better long-term reliability during power cycling.