Influence of deposition power of PECVD intrinsic a-Si:H buffer layer on n+ poly-Si/SiO /c-Si passivating contacts

等离子体增强化学气相沉积 图层(电子) 沉积(地质) 材料科学 化学气相沉积 缓冲器(光纤) 化学工程 化学 光电子学 纳米技术 电气工程 古生物学 工程类 沉积物 生物
作者
Zhirong Yao,Wei Si,Yingwen Zhao,Paul Prócel,Engin Özkol,Guangtao Yang,Prasad Gonugunta,Prasaanth Ravi Anusuyadevi,Peyman Taheri,Olindo Isabella
出处
期刊:Solar Energy Materials and Solar Cells [Elsevier BV]
卷期号:290: 113709-113709 被引量:1
标识
DOI:10.1016/j.solmat.2025.113709
摘要

Optimizing the deposition parameters in the fabrication of passivating contacts for crystalline silicon solar cells is critical for improving efficiency. This study explored the influence of varying RF power of Plasma-Enhanced Chemical Vapor Deposition (PECVD) on the quality of hydrogenated intrinsic amorphous silicon ( a-Si:H) films. The aim is to manufacture in-situ phosphorous-doped poly-Si/SiO x /c-Si passivating contacts with a-Si:H as buffer layer between the tunnelling oxide and the n-type poly-Si. The microstructure factor of our intrinsic layers increases from 0.176 to 0.804, that is from higher to lower film density, as the RF power increases from 5 W to 55 W. Analysis using X-ray Photoelectron Spectroscopy and Optical Microscopy indicates that the Si content in SiO x is correlated with the formation of pinholes. Our detailed analysis showed that varying the RF power when depositing a-Si:H contacting layer is crucial in altering both the Si 4+ content in SiO x and the pinhole density, due to the interplay between the plasma etching and the buffering effects during of the a-Si:H layer growth. Notably, the sample processed with 25 W exhibited the maximum pinhole density, the lowest Si 4+ content in SiO x and the deepest phosphorus in-diffusion, potentially yielding superior results in passivation quality and contact resistivity under optimized PECVD conditions. • Investigated the influence of PECVD intrinsic a-Si:H deposition power on n + poly-Si/SiOx/c-Si passivating contacts. • Revealed that increased RF power enhances plasma etching and modifies SiOx stoichiometry and Si 4+ content. • Clarified pinhole density evaluation methods and improved XPS data calibration with C1s correction. • Demonstrated that hydrogen plasma effects dominate passivation improvements compared to LPCVD references. • Insights contribute to the development of high-performance poly-SiOx passivating contacts for TOPCon solar cells.
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