光学
光互连
发射机
互连
铌酸锂
可扩展性
光电探测器
CMOS芯片
波分复用
材料科学
光纤
电子工程
数字信号处理
光通信
光电子学
光学性能监测
信号处理
光调制器
光交叉连接
计算机科学
光突发交换
光开关
光路
千兆位
硅光子学
光链路
光纤分路器
波长
数据传输
多路复用
带宽(计算)
三维光学数据存储
光学工程
光探测
光学晶体管
作者
Zhipei Wang,Xuanhao Wang,Jinwen Song,Xu Wang,Aoxue Wang,Shuai Yuan,Xiaohua Hu,Fangchen Hu,Haiwen Cai,Wei Chu
出处
期刊:Optics Letters
[Optica Publishing Group]
日期:2025-09-22
卷期号:50 (21): 6469-6472
摘要
The exponential growth of data traffic in modern data centers has driven the demand for ultra-high-bandwidth, low-power optical interconnects. While 200 Gbps per wavelength has become standardized, next-generation systems aim to exceed this benchmark without relying on power-hungry digital signal processors (DSPs). Leveraging the CMOS compatibility and scalability of germanium photodetectors (Ge-PDs) over traditional III-V-based counterparts, we report, for the first time, to the best of our knowledge, a 240-Gbps O-band optical interconnect over 2 km of standard fiber without any DSP and amplification in both optical and electrical domains. This demonstration employs a >70 GHz thin-film lithium niobate (TFLN) modulator and a 91 GHz Ge PD, establishing a viable path toward compact, energy-efficient, and high-speed heterogeneous integration for future optical transceivers.
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