A Miniaturized Glass on-Chip Microstrip Bandpass Filter with Low Insertion Loss Using TGV Technology

This paper presents a miniaturized on-chip microstrip bandpass filter on a glass substrate utilizing through-glass-via (TGV) technology. The design employs folded quarter-wavelength coupled line resonators to achieve compactness while maintaining high performance. Measured results demonstrate a center frequency of 5.025 GHz with a 17% fractional bandwidth, minimal insertion loss of 1.25 dB, and in-band return loss exceeding 14 dB. Two transmission zeros at 6.125 GHz and 6.725 GHz enhance out-of-band selectivity. The compact footprint of highlights significant miniaturization compared to existing designs. This work validates the feasibility of glass-based TGV technology for high-performance wireless communication systems, offering advantages in cost, scalability, and electrical performance.