Low-temperature polycrystalline-silicon TFT on 7059 glass
作者
W. Czubatyj,D. Beglau,R. Himmler,Guy Wicker,D.G. Jablonski,S. Guha
出处
期刊:IEEE Electron Device Letters [Institute of Electrical and Electronics Engineers] 日期:1989-08-01卷期号:10 (8): 349-351被引量:12
标识
DOI:10.1109/55.31753
摘要
A polycrystalline-silicon (poly-Si) thin-film transistor (TFT) deposited at low temperature on Corning 7059 glass is reported. It has practical applications for low-cost thin-film display and imaging electronics manufacturing. All the process steps used to fabricate the poly-Si device take place at temperatures of 550 degrees C or less. The poly-Si films exhibit crystallite grain sizes on the order of 5000 AA, and the fabricated devices show field-effect mobilities of 10-20 cm/sup 2//V-s and threshold voltages around zero. A plasma process to form the source and drain contacts has also been developed.>