Intelligent Multifield Collaborative Optimization Method for TSV Array With Performance Constraints

In this article, an intelligent multifield collaborative optimization method of a through silicon via (TSV) array with performance constraints is proposed. The multiphysical field-coupled cosimulation of the TSV array is carried out using COMSOL and ANSYS, and the effects of design parameters (radius, oxide thickness, pitch, offset angle, and height) on the performance (electrical, thermal, stress, and area) of the TSV array are analyzed. The mapping relationship between the design and performance parameters is established by a neural network. A collaborative optimization strategy with performance constraints is proposed, and the design parameters are optimized by a particle swarm optimization (PSO) algorithm. According to the optimized design parameters, the simulation results of the finite-element method (FEM) are basically consistent with the predicted performance. The maximum deviation between simulation verification and optimization results is 3.04%, and the proposed method reduces the search time by 99.52% and computation time by 83.86% compared to traditional methods, respectively.