大气温度范围
航程(航空)
分子
材料科学
粘结强度
氢键
热力学
化学
复合材料
物理
有机化学
胶粘剂
图层(电子)
作者
Minghan Hu,Jiu-Long Zhou,Li Jiang,Zhi Wang,Yu Bao,Shuxun Cui
标识
DOI:10.1021/acs.jpcb.5c00962
摘要
* = 7.88 - 1.34ln(T - 251.64). This formula enables the prediction of H-bond intrinsic strength at various temperatures within a reasonable range, which provides insights into the precise control of H-bond strength through temperature regulation. Although the formula may not be universally applicable, this pioneering work represents an upgrade in our understanding of this fundamental relationship from a qualitative to a quantitative perspective.
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