材料科学
微观结构
共晶体系
金属间化合物
扩散焊
扫描电子显微镜
复合材料
抗剪强度(土壤)
箔法
相(物质)
维氏硬度试验
光学显微镜
冶金
合金
环境科学
化学
有机化学
土壤科学
土壤水分
作者
Hamid Naeimian,Mohammad Ammar Mofid
出处
期刊:International Journal of Materials Research
[De Gruyter]
日期:2020-04-15
卷期号:111 (5): 424-431
被引量:6
摘要
Abstract The objective of this study is to investigate the effect of bonding temperature on the microstructure and mechanical properties of Al2024 and Ti-6Al-4V diffusion bonds using a 30 μm pure silver foil as interlayer. Using optical microscopy, scanning electron microscopy, line scan and X-ray diffraction, the interfaces of joints were evaluated. The mechanical properties of joints were measured using Vickers micro-hardness and shear strength. At the bonding temperature of 570°C joints contained a non-uniform distribution of elements and various intermetallic phases. With increasing bonding temperature, an uninterrupted microstructure is achieved. According to the results, liquid eutectic formed between Ag interlayer and Al2024, while solid-state diffusion occurs between the Ag interlayer and Ti-6Al-4V. The increase in bonding temperature from 570 to 580 °C resulted in higher shear strength, from 71 MPa to 121 MPa.
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