钴
线性扫描伏安法
电极
沟槽
循环伏安法
化学
伏安法
氢
分析化学(期刊)
空隙(复合材料)
吸附
材料科学
质子
电化学
无机化学
纳米技术
复合材料
色谱法
物理化学
物理
有机化学
图层(电子)
量子力学
作者
Jungkyu Kang,Minjae Sung,Jinuk Byun,Oh Joong Kwon,Jae Jeong Kim
标识
DOI:10.1149/1945-7111/abb284
摘要
Cobalt electrodeposition involves hydrogen reduction reaction, and the proton supply in feature filling varies depending on the location because of the topographical characteristics, thereby resulting in changes on the electrode surface, such as changes in pH and hydrogen adsorption. Based on this phenomenon, void-free trench filling was performed using benzimidazole (BZI) as an additive, which has different suppression effects depending on pH. Linear sweep voltammetry experiments confirmed the change in suppression behavior of the additive according to pH. Chronoamperometric transients were performed at a fixed BZI concentration to confirm the potential region, wherein actual cobalt deposition was suppressed. Chronoamperometric analysis with various rotation rates was also conducted to demonstrate the effect of proton concentration near the electrode on the suppression effect of BZI. Finally, a void-free filling working mechanism in a low aspect ratio trench using BZI was proposed. This study proposes, a single additive, whose suppression behavior changes according to the change in pH of the electrode surface, by considering the pH of the cobalt deposition solution and pK a value of the additive. Furthermore, it was demonstrated that void-free filling can be performed even in a trench with a low aspect ratio.
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