A Study on Adhesively Bonded Aluminum Plates Under Shock-Wave Loading

Adhesive joint technology has been developed gradually, and the application fields of this type of joints have been expanded increasingly since they reduce the weight of the applications, provide uniform stress distribution across the joints, allow to bond similar, and dissimilar materials, and contribute to dampen the shock, and vibration. However, the performance of the adhesive joints under high loading rate such as blast or ballistic loading has been studied by few researchers. In this study, fully laminated plates consisting of 6061 aluminum plates (15” in diameter and 1/16” thick) and FM300K epoxy film adhesive were tested under shock wave loading. Full displacement field over the testing plates were obtained by TRC-SDIC technique, and the strain on the plates were computed by classical plate theory for large deflections. FEM model was analyzed and the results were compared with experimental results.