材料科学
光电子学
薄脆饼
晶片键合
激光器
炸薯条
光学
电气工程
工程类
物理
作者
Takuo Hiratani,Naoki Fujiwara,Naoko Inoue,Munetaka Kurokawa,Takehiko Kikuchi,Takuya Mitarai,Toshiyuki Nitta,Tohma Watanabe,Hidenari Fujikata,Nobuhiko Nishiyama,Hideki Yagi
标识
DOI：10.1109/siphotonics60897.2024.10543526
摘要
The SOA integrated InP/Si hybrid tunable laser is demonstrated. Each gain sections for the laser and SOA is monolithically integrated on the Si waveguide by chip-on-wafer hydrophilic bonding. The maximum light output power of 26 mW is achieved thanks to the integrated SOA.
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(2025-6-4)
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