Plasma etch of binary Cr masks: CD uniformity study of photomasks utilizing varying Cr loads: III

The use of Plasma Etch for the fabrication of Binary Cr Photomasks has become a mainstream staple for advanced Reticle fabrication. These Binary Cr Reticles are suitable for the 0.18 micron technology Nodes and beyond and have forced an appreciation of the varying exposed Cr loads of different Mask layers.