P‐77: Advanced Encapsulation Film for Micro‐LED Display

Most of the encapsulation films seen in the market use non‐pre‐metered coating technology, like dip coating or spray coating, which is difficult to control the film thickness, has poor film uniformity, low material utilization, and can only be coated on the front side, but cannot be used for three‐dimensional encapsulation. We proposed a silicone B‐stage material with coating and lamination processes, which can greatly reduce the cost of the process, improve the uniformity of film formation, and achieve the conformal coating of micro‐LED.