Recent advances in oscillating heat pipes for passive electronics thermal management

Oscillating heat pipes (OHPs) have been the subject of significant research. Prior literature includes examples with higher overall thermal resistances and temperature fluctuations than typically desired in electronics cooling. More recent research has led to more stable OHP performance, with thermal resistances competitive with conventional heat pipes while transferring higher heat fluxes from devices of complex geometries. This paper presents recent advancements in OHP-based heat spreaders and heat sinks for high power density, densely-packaged electronics systems.