Progress, challenges and potentials/trends of tungsten-copper (W Cu) composites/pseudo-alloys: Fabrication, regulation and application

Tungsten‑copper (WCu) composites/pseudo alloys with excellent properties are extremely desirable for applications as electrode materials, functional graded materials, electronic packaging materials, electrical contacts, as well as other aerospace and military candidates. This paper reviewed the recent progress on fabrication techniques, microstructure and property regulation that ensure high-performance WCu alloys. Besides the well-developed traditional powder metallurgy including the parameter modification, powder pre-treatment and severe plastic deformation post-treatment, extensive novel sintering or manufacturing techniques including microwave sintering, spark plasma sintering, field-assisted sintering and additive manufacturing of WCu alloys are reviewed, along with various chemical methods for nano-powder synthesis. Subsequently, the microstructure and property regulation by pure metal elements and introduction of second phases with great details are provided. Based on the review with all-sided perspectives for WCu alloys, future developments and potential research challenges for WCu alloys are summarized and proposed finally.