Dynamic Recrystallization of Pure Tin

Constant-compressive-load creep testing on polycrystalline (average grain size; 1.48 mm) and [110] single crystalline Sn was carried out at 393 K. Rapid increases in the creep rate (strain burst) were observed for polycrystalline Sn under stresses ranging from 3.5 to 5.5 MPa. The strain burst was also observed for a single crystalline Sn at 5 MPa. Microstructural observations revealed that the newly recrystallized grains contain subgrains and that the strain burst is caused by dynamic recrystallization. A constant-compression-speed testing was also performed at a strain rate of 1.67×10−3 s−1 and at 393 K. The stress-strain curve showed a multipeak stress-strain curve which is typical of dynamic recrystallization.